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MagicRay Inline 3D AOI VS7000
■3D inspection for post reflow PCBA with the advantages of high stability, high detection and low falsecall
■ Perfect combination in between 2D and 3D, ideal solution to overcome the limitation of the 2D meanwhile make up the eakness of 3D
■ Adopt heigh

■ Optical Imaging Principle
● By means of phase shift projection, the information of the height of the object with diffuse reflection can be well restored.

■ Advanced Hardware Architecture

● Granite Platform And Frame
Ensure the stability of the equipment and the consistency of sharing program between machines.

 ● Industrial Camera + Telecentric Lens
The high component solder joint inspection is not affected as no shadow effect in the entire of view.

■ Core Technology and Advantages

● Intelligent Zero Reference Point Technology
If the zero reference point falls to solder pad or component due to PCB warpage and will cause "Icicle" phenomenon. This phenomenon will cause all the component owns the value of the component height lower than actual. The offset of zero reference point can effectively overcome by intelligent zero reference point technology.

● Height Cross Section Positioning Technology
The problem of positioning can be effectively overcome by height cross section positioning technology without the interference of silkscreen, the changing of the color of PCB background and the incoming material.
● Intelligent Copanarity Inspection Technology
The combination of co planarity inspection and absolute height can completely eliminate the false call due to the height variation due to the different batch of incoming material.

● 3D + 2D Combination Algorithm
Specular reflection is a total reflection, so a lot of information cannot be captured by the camera on the solder joint surface with the high angle. The phase shift method unable to obtain enough data for calculation. Therefore, the detection of high angle solder joint is a blind spot in 3D. However, color 2D can compensate for this defect. Hence, the combination of 3D and 2D is the best way to detect solder joint.
The open solder on the lead-free floating area and the insuficient solder on the solder joint can also be accurately detected.