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MagicRay Inline 3D SPI VSP3000
■ For solder paste inspection after SMT printing
■ Dual projection contributes to provide the 3D information of the solder paste
■ High speed industrial camera can meet the needs of high output of the production line
■ A variety of ways to determine th
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■ Optical Imaging Principle 
● By means of phase shift projection, the information of the height of the object with diffuse reflection can be well restored.

■ Core Technology and Advantages 

● Easy and Fast Programming
Programming wizard makes it easy to operate and quick to get started.

● Automatic Zero Reference Point Technology
The zero reference point is generated automatically which able to shorten the programming time.
 
● Color Filtration Technology
Can effectively overcome the" icicle" phenomenon caused by zero reference misalignment and solder paste overflow after the PCB warpage.

● Cross Section Analysis Function
Contibute flexibly to analysis the shape of solde paste.

● High Map Cross Section Algorithm
Can effectively detect the" icicle" of the solder paste.

● Detection for Broken Solder
Adopting the algorithm of maximum cross section enclosed to effectively detect the bad situation of broken solder.

● SPC
Automatic export of detection data can be customized.
Rich data charts can meet the requirements of on-sitequality tracking and quality analysis.